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This event is co-located with a conference on quantum dots.
May 5, 2021
By: Anthony Locicero
Copy editor, New York Post
TechBlick’s third virtual conference and exhibition on May 11-12 will cover Printed, hybrid, structural and 3D electronics. This event is co-located with a conference on quantum dots, which covers the latest material innovations and emerging applications. The speaker and panelist line-up feature leading global organizations, including Boeing, Airbus, Coca-Cola, P&G, HP, ARM, Wuerth, Signify, US Army, Panasonic, Parsons, Texas Instruments, Identiv, Kimoto, Agfa, and many ot...
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